| http://www.w3.org/ns/prov#value | - As a result of this, the flow speed at which the bonding material 95 flows in the regions other than the portions at which the bumps 92, . . . , 92 are disposed within the bonding surface of the IC chip 91 on which the passivation film 99 is disposed is maintained generally the same, so that the bonding material 95 can be prevented from lowering in density, and therefore prevented from lowering in
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