| http://www.w3.org/ns/prov#value | - When put on the market, the latent curing agent for epoxy resin of the present invention may further contain, if desired, any known curing agent of, for example, dicyandiamides, hydrazide compounds, guanamine compounds or phenol-novolak resins, as well as other additives such as surface-treating agents, inorganic fillers and pigments.
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