| http://www.w3.org/ns/prov#value | - The process up to the above is a process PR1 shown in FIG. 9.Next, as shown in FIG. 13, a seed film 106 made of a material the same as the material for forming the interconnections, for example, copper is formed on the barrier film 105 to a thickness of for example about 150 nm by the well known sputteringprocess (process PR2).
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