About: http://webisa.webdatacommons.org/155620594

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	These landing pads are generally part of the last metal layer interconnect from the semiconductor device, and comprise metal such as aluminum (Al) and copper (Cu).
http://www.w3.org/ns/prov#wasQuotedFrom	google.com