| http://www.w3.org/ns/prov#value | - A layer of intermetallic compounds forms between each copper pad and solder body after a reflow; the compounds include grains of copper/tin and copper/silver/tin compounds, such as Sn3Ag, Ag3Sn, (CuX)6Sn5 and others, wherein X is a transition metal from the solder body.
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