| http://www.w3.org/ns/prov#value | - tion layer; high density mounting; surface acoustic wave deviceUS6448635 *30 Ago 199910 Sep 2002Amkor Technology, Inc.Surface acoustical wave flip chipUS64676708 Ene 200122 Oct 2002Matsushita Electric Industrial Co., Ltd.Method and apparatus for mounting componentUS6541848 *13 Oct 19981 Abr 2003Fujitsu LimitedSemiconductor device including stud bumps as external connection terminalsUS6550664 *9 Di
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