| http://www.w3.org/ns/prov#value | - It may be understood that the reinforcing structure of the present invention is applicable to strengthen a damascene bond pad with underlying weak dielectric layers so that it may withstand stresses and forces imparted during multiprobe testing, any wire, solder, or other bonding processes, such as ball bonding, wedge bonding, ultrasonic bonding, thermosonic bonding, thermocompression bonding, sol
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