| http://www.w3.org/ns/prov#value | - It is generally formed on the rear surface of the base layer. [0144] The polishing pad and polishing laminated pad of the present invention are suitably used to polish a material to be polished such as a semiconductor wafer or liquid crystal substrate. [0145] Since the polishing pad of the present invention has transmits light through its light transmitting member, when it is set in a polishing ma
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