| http://www.w3.org/ns/prov#value | - thickness monitorUS5663797 *May 16, 1996Sep 2, 1997Micron Technology, Inc.Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafersUS5733176 *May 24, 1996Mar 31, 1998Micron Technology, Inc.Polishing pad and method of useUS5762537 *Mar 21, 1997Jun 9, 1998Micron Technology, Inc.System for real-time control of semiconductor wafer polishing including heat
|
