| http://www.w3.org/ns/prov#value | - Still further, the communication holes 5 increase the area of contact between the dielectric lamination structure 1 and the insulating resin layer 16 (V2a), as a result of which the adhesion between them isincreased and such trouble as peeling can be avoided.Then, as shown in FIG. 7 (7-2), an insulating resin layer 16 (V2b) made of a thermosetting resin composition or the like is formed so as to c
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