| http://www.w3.org/ns/prov#value | - tion, can be used to form microelectromechanical devices such as microsensors and microactuators, including buckling beam thermal actuators.Dimensions of structures fabricated by MEM technologies can range from on the order of 0.1 ??m, to on the order of a few millimeters, and include silicon, polysilicon, glass, dielectric and metallic structures that are either unsupported (i.e. free standing) o
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