| http://www.w3.org/ns/prov#value | - te 142 is then metallized on both sides by metal deposition, sputtering, or other metal application techniques; (3) a signal pattern is then printed on a top side of the first substrate 142 by etching away the metal other than the pattern that is to become the printed lumped element circuit???this forms the printed signal carrying layer 140; (4) a second dielectric substrate 150 is then laminated
|
