| http://www.w3.org/ns/prov#value | - A semiconductor processing method of forming a pair of openings comprising:etching a pair of openings over a substrate to a first selected depth; depositing a polymer film at least partially within the openings, one of the openings being occluded by the polymer film, the other opening not being occluded by the polymer film; exposing at least a portion of a base of the other opening by removing the
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