| http://www.w3.org/ns/prov#value | - A third aspect of the present invention is a method of forming a buried dielectric collar around a trench, comprising: (a) forming the trench in silicon substrate; (b) forming a multilayer coating on sidewalls and a bottom of the trench, the multilayer coating comprises in order from the substrate outward, a layer of silicon oxide, a first layer of silicon nitride, a layer of polysilicon and a sec
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