| http://www.w3.org/ns/prov#value | - It is believed that when a substrate is processed with the polishing pads described herein, a definite pressure is applied to the pad of polishing article, whereby the resulting pressure causes the second polishing material to flex and contact the bevel edge to polish material deposited of the substrate, such as copper and tungsten, while the field of the substrate is polished by the first polishi
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