| http://www.w3.org/ns/prov#value | - FIGS. 15A to 15C show fuses in a semiconductor device according to the sixth embodiment of the present invention, in which FIG. 15A is a top view partly cut to show parts positions, FIG. 15B is a sectional view taken along a line I???I of FIG. 15A, and FIG. 15C is a sectional view taken along a line II???II of FIG. 15A. An opening 4 is formed in a polyimide film 1 and a passivation film 7, and fol
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