| http://www.w3.org/ns/prov#value | - It involves: Step 1: The deposition of a Ti/TiN contact layer as to ensure low contact resistance to N+, P+, Poly 1 and other underlying materials followed by the deposition of tungsten layer using chemical vapour deposition, CVD; Step 2 and Step 3: The etch-back of the CVD-W layer as to leave tungsten plugs in contacts regions followed by the deposition of a TiN/AlSiCu/TiN layer at high temperatu
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