| http://www.w3.org/ns/prov#value | - Other measuring principles are not particularly limited. [0192] According to this method of polishing a semiconductor wafer, polishing can be performed while always observing a polishing endpoint, for example, (i) by arranging window members on a disc center and concentrically or by using a ring-like window member where the polishing pad or the polishing multi-layered body is disc-like, (ii) by ar
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