| http://www.w3.org/ns/prov#value | - It is preferred that in the impurity semiconductor region forming step, a plurality of the impurity semiconductor regions are formed; in the recessed portion forming step, a plurality of the recessed portions are formed, respectively, for the plurality of impurity semiconductor regions; and in the window plate bonding step, the window plate is bonded to the outer edge portion in such a manner as t
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