PropertyValue
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  • tterns M.sub.1, M.sub.2, M.sub.3, illustrated in FIGS. 1A and 1B in a thin layer such as the technological layer 110, a method consists of forming these patterns M.sub.1, M.sub.2, M.sub.3, by photolithography,directly in this technological layer 110 and without utilising an intermediate sacrificial layer.FIG. 4 illustrates this technological layer 110, added for example by photolithography, requir
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