| http://www.w3.org/ns/prov#value | - th a preferred embodiment of the present invention, corresponding generally to FIGS. 1A and 1B; [0027]FIG. 3 is a partially cut-away sectional illustration of a crystalline substrate based device of the type shown in FIGS. 1A & 1B; [0028]FIGS. 4A, 4B, 4C, 4D & 4E are simplified illustrations of steps in a method for producing a packaging layer for use in crystalline substrate based device in accor
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