| http://www.w3.org/ns/prov#value | - 20140045326METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A POST-PASSIVATION INTERCONNECT STRUCTURE - A method of making a semiconductor device includes forming a passivation layer overlying a semiconductor substrate, the semiconductor substrate having a first region and a second region, wherein the first region is a conductive pad and the second region is adjacent to the first region.
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