About: http://webisa.webdatacommons.org/163093153

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	After soldering, flux residues remain on the circuit boards, which brings the same problems as described herein for reflowsoldering.Wafer bumping is a process used to make thick metal bumps on the chip bond pads for inner lead bonding.
http://www.w3.org/ns/prov#wasQuotedFrom	patentgenius.com