| http://www.w3.org/ns/prov#value | - By manufacturing integrated circuit device 1 in such a manner as described above, the structure wherein radiating plate 3 having the large number of recesses 10 formed on the outer peripheral portion thereof is exposed to the lower face of resin package 8 and lead terminals 5 extending outwardly from the side faces of resin package 8 are bent in a J-shape such that the free ends of lead terminals
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