About: http://webisa.webdatacommons.org/163751608

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 1 is a schematic description of the thermomechanical deformation experienced by an organic substrate at different stages in an IC packaging process.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com