| http://www.w3.org/ns/prov#value | - After the wafers 2 are stacked onto the wafer 9, leaving exposed the peripheral margins of the wafer 9 and the exterior pads 11 for external attachments, a jig (not shown) is placed on top of the array 1 and filled with a pool of electrically conductive liquid, such as mercury, which covers all of the through-holes 5.
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