| http://www.w3.org/ns/prov#value | - By way of summary, the present embodiment provides a wafer polishing head for polishing a semiconductor wafer or other substrate on a polishing pad, where the polishing head includes a retaining ring having an interior cylindrical surface and defining an interior cylindrical pocket sized to carry the wafer and to laterally restrain movement of the wafer when the wafer is moved relative to the poli
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