| http://www.w3.org/ns/prov#value | - By this arrangement, active surface 20 of image sensor chip 18 may receive light or other forms of radiation passed through transparent lid 8. [0022] Turning to FIGS. 4 and 5A through 5G, a first exemplary embodiment of the present invention and method of assembly thereof is illustrated. [0023]FIG. 4 shows a sectional side view of an image sensor package 1??? including image sensor chip 18 mounted
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