| http://www.w3.org/ns/prov#value | - As shown in FIG. 4, a wiring structure according to a first embodiment of the present invention includes: a substrate 100 having a device (for example, formed of transistors and/or capacitors) (not illustrated) formed thereon; a plurality of signal conductive films 140, e.g., a conductor such as an aluminum, for transmitting a signal and formed on the substrate 100 by photolithography; and an arbi
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