| http://www.w3.org/ns/prov#value | - By way of definition, when a ???high density??? of test signal paths between the pads of an integrated circuit wafer being test probed is referred to herein, what is meant is that there are enough test signals provided to enough flex probes contacting the bonding pads of the wafer to allow full simultaneous high frequency testing of at least 128 integrated circuit chips of the wafer; the definitio
|
