| http://www.w3.org/ns/prov#value | - This type of polishing apparatus comprises, as shown in FIG. 21, a polishing table 402 having a polishing cloth (polishing pad) 400 attached thereon and constituting a polishing surface, and a top ring 404 for holding a substrate W as a workpiece to be polished, such as a semiconductor wafer, in such a manner that a surface to be polished faces the polishing cloth 400.
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