| http://www.w3.org/ns/prov#value | - The electronic component mounting apparatus 100 according to the invention comprises a solder cream transfer apparatus 200 for transferring the solder cream to the connecting terminal of the electronic component such as a BGA, and the solder cream transfer apparatus 200 is attached to a parts feeder fixing table 154 and the solder cream is put on the transfer unit 210.
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