| http://www.w3.org/ns/prov#value | - This is done because, if the subsequent step of forming a copper foil at high deposition speed is carried out without roughening the specular surface, undesirably early peeling of the deposited copper will occur, that is, part of the deposited copper will be peeled off too early by the high-speed flow of the plating solution or other external forces such as vibrations.
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