PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • FIG. 11 is a schematic cross sectional view of an alternate embodiment semiconductor die having the polymer film bonded thereto with a compressible member therebetween;
http://www.w3.org/ns/prov#wasQuotedFrom
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