| http://www.w3.org/ns/prov#value | - Subsequently, as shown in FIG. 3C, an additional resist pattern RP4 is formed on the resulting surface except regions thereof on which the bumps BM1, BM2 are to be formed, i.e., regions thereof which face the openings 16A, 16B, and then the resulting surface is subjected to electroplating with the use of the material for the bumps BM1, BM2.
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