About: http://webisa.webdatacommons.org/174470385

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	If the solder bumps are enlarged in size so as to increase reliability after mounting, problems including the occurrence of bridges, etc., are created during mounting of the device on the substrate and formation of solder bumps.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com