About: http://webisa.webdatacommons.org/174565969

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Also, the assembly and encapsulation methods discussed above can be employed to package microelectronic elements other than semiconductor chips or assemblies including semiconductor chips.
http://www.w3.org/ns/prov#wasQuotedFrom	google.co.uk