| http://www.w3.org/ns/prov#value | - BACKGROUND OF THE INVENTION [0001] 1) Field of the Invention [0002] The present invention relates to semiconductor devices and manufacturing methods therefor, and more particularly, relates to a semiconductor device including wires consisting of elemental titanium (Ti) or a Ti-containing conductive material and to a manufacturing method therefor. [0003] 2.
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