| http://www.w3.org/ns/prov#value | - As further illustrated in FIG. 4, backside metallizations 36 are formed of an electrically conductive metal such as gold (Au), platinum (Pt), aluminum (Al), etc. on the first surface 12 of the substrate 10 to provide a ground plane and heat sink for heat generated during operation of the devices 16, 22 and 24.
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