PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In some cases, a module that uses epoxies, adhesives, solder and/or other bonding agents will be subject to subsequent processing steps exposing the module to high temperatures or other processing conditions.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com