| http://www.w3.org/ns/prov#value | - Combining a generalized heat sink for the wafer 150 or other structure and localized heating for the DUT 166, can be used to improve temperature accuracy when testing at low temperatures or to thermally cycle a DUT. Operating the thermal chuck 20 as a heat sink can be used to depress the temperature of the wafer 150 or other structure to a temperature below the test temperature.
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