| http://www.w3.org/ns/prov#value | - own in FIG. 6.It should be apparent that all communications among the design facility 104, manufacturing facility 106, local test facility 108, and central test facility 102, may be made wirelessly via transceivers 112, 116, 118, and 120.FIG. 7 illustrates another exemplary system, which may be used to test electronic devices, such as semiconductor dies.
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