About: http://webisa.webdatacommons.org/182845087

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Excursions in grain size of rough interconnect films such as copper (Cu), tungsten (W), and polysilicon can be monitored using this technology.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com