| http://www.w3.org/ns/prov#value | - Moreover, particularly on the surface of said metal layer, Cu???Ni???P alloy or other plating metal tends to deposit in the formation of a roughened layer by plating and bare spots do not remain even if the plating solution deteriorate so that a satisfactory roughened layer composed of acicular or porous Cu???Ni???P alloy can be certainly formed on the conductor circuit.
|
