| http://www.w3.org/ns/prov#value | - For example, the tip device can be prepared by several processes such as heat pulling, acid and/or solvent etching, laser micro-machining, laser post processing, E-beam micro-machining, injection molding, corona or electrical arcing, ultra-sound modification, high impact/high temperature powder crushing, grinding, masked lithography/etching, and micro-stereo lithography.
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