| http://www.w3.org/ns/prov#value | - After a metal layer made of aluminum (Al), aluminum alloy or copper (Cu), for example, is formed by sputtering, plating or other film forming method, the metal layer is etched using a resist layer (not shown) as a mask to form pad electrodes 4 of a thickness of 1 ??m, for example, on the insulation film 3.
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