| http://www.w3.org/ns/prov#value | - Next, the whole surface of the wafer 7 was coated with a photosensitive epoxy resin, followed by again going through the exposure/development step and heat-hardening step, to form a 15 ??m thick insulating pattern 8 on the whole surface of the wafer except the portions where the aluminum electrodes were formed (see FIG. 5).
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