About: http://webisa.webdatacommons.org/185528206

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	It is therefore preferred to use a thermosetting resin such as epoxy resin as a resin material for the sealing portion of the semiconductor chip 7.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com