PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Here, the cementing material used in die bonding is not specifically limited and insulating adhesives such as epoxy resin, Au???Sn alloy, resin or glass containing conductive material, or the like, can be used.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com