PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • d intermetal dielectric layer 722 is removed using an oxygen strip or other suitable process. [0104] The metallization structure is then formed with a conductive material such as aluminum, copper, tungsten or combinations thereof.
http://www.w3.org/ns/prov#wasQuotedFrom
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